EMIB-T，即“EMIB with TSV（Through-Silicon Via）”，是在英特尔原有EMIB（嵌入式多芯片互连桥）技术基础上的一次关键升级。传统EMIB利用嵌入在封装基板中的硅桥，实现多颗裸晶之间的高速互连。
The BMA's current mandate for industrial action runs out in early January, but it has started asking its members whether they want to extend the dispute.
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System dialogs like password dialogs now have a blur effect in addition to the dim effect. Plus we made sure to disable hotcorners while they are present and fixed a bug that prevented using accessibility shortcuts—like zoom.
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